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PCB processing to consider what issues

Because PCB manufacturers have special production and processing technology for various types of plates.

2022-04-14

PCB processing to consider what issues

In today's electronics industry, PCB is the most indispensable key component of the entire electronic product. Since PCB manufacturing involves many fields, if you have not participated in the PCB production process during PCB design operations, it is conceivable that it will directly lead to more emphasis on performance and function in the design process. Then in the factory production process, PCB design will not consider the difficulty of product processing, because PCB manufacturers have special production and processing technologies for various plate types. Therefore, PCB board processing must take into account the following issues.

1. Selection of plate

PCB plates are divided into two types: mechanical and chemical raw materials and inorganic raw materials. The selection of plate types should be determined by combining the characteristics of base groove thickness, electrical properties, copper foil types, production and processing, etc.

2. Control of the environment

The indoor environment of PCB production and processing workshop is also a key issue, and the control of working temperature and humidity is particularly important. If the temperature is too high, it may cause the hole on the plate to break. Secondly, the humidity is too high, which has an impact on the characteristics of the plate with strong water absorption capacity, mainly in the dielectric electrical performance level. Therefore, it is necessary to maintain a standard natural environment when PCB board is produced and processed.

3. Plate through-hole blockage

For example, PCB surface mount boards, especially BGA and IC mounting, have relatively high requirements for through-hole plugs. They must be flat, convex and concave plus or minus 1mil, and there must be no red tin on the edge of through-hole. Due to the complicated and long process of the conducting hole plug hole, which increases the difficulty of process control, oil will fall off during hot air leveling or green oil solder resistance test, and oil explosion will occur after curing. Therefore, we must have the board surface welding and plug holes completed at the same time.

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