Process Capability
| Project | regular ability | ultimate ability | |
| Number of layers | Layers 1-20 | Layers 1-20 | |
| Plate thickness | 0.15mm - 3.0mm | 0.15mm - 3.5mm | |
| Finished copper thickness | 1-4oz | 1 - 6oz | |
| Borehole diameter tolerance | Minimum blind hole | 0.1mm | 0.075mm |
| Minimum Buried Hole | 0.2mm | 0.15mm | |
| Minimum through hole | 0.2mm | 0.2mm | |
| Maximum plated hole aspect ratio (through hole) | ≤ 10:1 | ≤ 10:1 | |
| Maximum Plated Hole Aspect Ratio (Laser) | ≤ 0.8:1 | ≤ 1:1 | |
| aperture tolerance | PTH ±0.075mm | ±0.075mm | |
| NPTH ±0.05mm | ±0.05mm | ||
| Half hole ± 0.05mm | Half hole ± 0.02mm (if the customer has special tolerance requirements) | ||
| Plate bending/warpage | ≤ 0.75% | ≤ 0.5% | |
| CNC Gong Plate Tolerances | ± 0.1mm (the lamp panel is controlled according to/-0.075) | ±0.075mm | |
| Die punch tolerance | ±0.1mm | ±0.075mm | |
| impedance tolerance | ±10% | ±10% | |
| Inner minimum line width/line spacing | 0.06 /0.06mm （2.5/2.5mil） | 0.06 /0.05mm （2.5/2mil） | |
| Outer minimum line width/line spacing | 0.06 /0.06mm （2.5/2.5mil） | 0.06 /0.05mm （2.5/2mil） | |
| Minimum BGA Pad | 0.2mm | 0.20mm | |
| Minimum BGA Spacing | 0.4mm | 0.35mm | |
| Maximum size of shipping panel |
Conventional: 540*700mm Unconventional: 540*1200mm |
Conventional: 540*700mm Unconventional: 540*1200mm |
|
| PAD Size/Minimum Drill | 0.4mm pad/0.2mm drill tip | 0.4mm pad/0.2mm drill tip | |
| Special process | Blind buried hole, half hole plate, high frequency plate, control deep hole, fill hole plating, long and short gold fingers, thick gold plate, copper substrate, etc. | ||
Lianmeng Electronics
Contact: Mr. Xiao
383 South Longhu Avenue, Huicheng District, Huizhou City, Guangdong Province
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